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Embedded Modules

COM Express and COM-HPC are a family of modular, small form-factor Computer-On-Module (COM) specifications that make processing and networking capabilities available to automation, gaming, retail, transportation, robotics, medical, and other technology-driven markets.

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COM Express

COM Express defines a range of compact size modules aimed at mid to low power edge processing applications. Different size modules are available under the PICMG standard (most common shown below), the major differences between all three modules are the supported CPUs and the number of I/O signals available to the carrier

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The primary feature that sets COM Express apart from traditional single-board computers (SBCs) is the ability to plug off-the-shelf modules into custom carrier boards designed to application-specific requirements. In other words, a custom COM Express carrier board can be designed into a system to transport all necessary signals to and from subsystems and peripherals, and off-the-shelf COM Express processor modules can plug directly into the carrier and serve as the main controller. This dual-board architecture precludes the high-speed interfacing and signal integrity expertise users would otherwise require in the design of their own processor modules, reduces time-to-market, and provides a scalable upgrade path to newer modules should the application require more performance in the future.

Typical COM Express Module Specifications

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COM Express Mini

  • Intel® Tiger Lake UP3 processors 15W TDP
  • 16GB LPDDR4X 4266MT/s and IBECC support
  • USB4 compliance supported by carrier board design
  • NVMe SSD onboard

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COM Express Compact

  • 13th generation Intel® Core™ processor 45W TDP
  • COM Express R3.1 compact module Type 6 pin-out
  • Dual channel memory up to 64GB, 4800MT/s DDR5
  • High speed I/O: 16x PCIe Gen4, 8x PCIe Gen3, 2x USB4 & 4x USB3.2 Gen2

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COM Express Basic

  • 11th generation Intel® Core™ Processors up to 8Core/16T, L3 Cache 24M 45W TDP
  • Intel™ Iris Xe(Gen 12) graphics, 4 independent 4K display
  • Dual channel DDR4 max 128GB SODIMM, support ECC
  • Super speed I/O: PCIe4 x16 (16GT/s), USB3.2 gen3 (10Gb), 2.5GbE, SATA3 (6Gb)

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COM Express Basic

  • Intel® Xeon® D-1700 processors
  • COM Express R3.0 basic module Type 7 pin-out
  • 4~10 core processor with max. TDP 67W
  • High speed Ethernet (4 x 10GBASE-KR interfaces, one GbE)
  • Various expansion (PCIe x16 Gen4, PCIe X8, 4PCIe X1, 4 USB3.0, 2 SATA3)


COM-HPC defines a range of larger size modules aimed at higher power processing applications such as high-end IoT devices or embedded edge servers, where features such as PCI Express Gen5, USB4, and 25GbE are essential. The modules support server class processors thanks to a larger module footprint and support for higher power delivery to the processor. 

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Server class modules feature larger memory sockets which allow for much higher memory configurations. This technology compliments COM Express by extending support all the way up to high-end applications, both in client and server classes.

Similar to COM Express, COM-HPC modules are designed to be part of a system consisting of the module itself and a carrier board designed for the end application, for example: a 5G virtual network may require a carrier with high-speed Ethernet connectivity, storage, and multiple 5G modems.

Two pin-out types are defined in the COM-HPC standard, namely Server and Client as pictured above.

Typical COM-HPC Module Specifications

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Size E Module

  • Up to 64C/225W AMD EPYC™ 7003 real server-grade CPU with extreme performance
  • Up to 512GB large memory size with 4x DDR4 long DIMM
  • 79 PCIe Gen4 lanes (14 more than COM-HPC STD)

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Size D Module

  • Intel® Xeon® D-2700 processors
  • Up to 20 cores, 30MB LLC Cache, 118W TDP
  • Quad channel DDR4-3200 RDIMM/LRDIMM up to 512GB (both ECC and Non-ECC)
  • 32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR, and IPMB lanes

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Size C Module

  • Intel® Raptor Lake-S/Alder Lake-S desktop socket-type CPU
  • Up to 16 cores, 24 threads, 65W TDP
  • Dual channel DDR5 SODIMM max. 128GB (both ECC and Non-ECC)
  • 16 PCIe Gen5,16 PCIe Gen4, and 10 PCIe Gen3 lanes


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